Manufacturing method for display device

ABSTRACT

The exemplary embodiments relate generally to a display device that may include: a first substrate and a second substrate, each including a transparent encapsulation area; an outer sealant along a side of the transparent encapsulation area; a pattern part disposed on the first substrate and extending in a direction parallel to the outer sealant; and a transparent sealant adjacent to the pattern part and extending in a direction parallel to the pattern part, and a manufacturing method thereof.

CROSS-REFERENCE TO RELATED APPLICATIONS

This is a divisional application based on pending application Ser. No.15/259,127, filed Sep. 8, 2016, the entire contents of which is herebyincorporated by reference.

Korean Patent Application No. 10-2015-0139957, filed on Oct. 5, 2015, inthe Korean Intellectual Property Office, and entitled: “Display Deviceand Manufacturing Method Thereof,” is incorporated by reference hereinin its entirety.

BACKGROUND 1. Field

Example embodiments relate generally to a display device and amanufacturing method thereof.

2. Description of the Related Art

A liquid crystal display and an organic light emitting diode display maybe representative of a flat panel display (FPD).

A display device may have a built-in camera for video chatting, videoconferencing, etc.

SUMMARY

Exemplary embodiments provide a display device that may include: a firstsubstrate and a second substrate, each including a transparentencapsulation area; an outer sealant along a side of the transparentencapsulation area; a pattern part disposed on the first substrate andextending in a direction parallel to the outer sealant; and atransparent sealant adjacent to the pattern part and extending in adirection parallel to the pattern part.

The first substrate may further include a light blocking memberincluding an opening.

The transparent sealant may be formed to include an area correspondingto the opening.

The width of the transparent sealant may be larger than a diameter ofthe opening.

The first substrate may further include an overcoat layer on the lightblocking member.

The pattern part may be on at least one of the overcoat layer and thelight blocking member.

The pattern part may be on the overcoat layer and a height of thepattern part may be the same as that of the outer sealant.

The pattern part may be on the light blocking member and the patternpart may be a multi-layered structure.

The pattern part may be on the overcoat layer and the overcoat layer maybe on the light blocking member, and the overcoat layer may include arecess portion with a shape that is depressed toward a side of the firstsubstrate on an area corresponding to the opening.

The pattern part may be a same material as at least one of a colorfilter and a column spacer of the display device.

Exemplary embodiments also provide a method for manufacturing that mayinclude: forming a pattern part extending in a direction along a side ofa transparent encapsulation area of a first substrate or a secondsubstrate; forming an outer sealant parallel to the pattern part;forming a transparent sealant adjacent to the pattern part and extendingin a direction parallel to the pattern part; and sealing the firstsubstrate and the second substrate, wherein forming the transparentsealant is performed such that the transparent sealant has apredetermined interval with the outer sealant and fills between thefirst substrate and the second substrate.

Forming the transparent sealant may be performed by a one-time process.

Forming the pattern part may be simultaneously performed with a step offorming a color filter in a display area of the first substrate thatdisplays an image.

Forming the pattern part may be simultaneously performed with a step offorming a column spacer in a display area of the first substrate thatdisplays an image.

BRIEF DESCRIPTION OF THE DRAWINGS

Features will become apparent to those of ordinary skill in the art bydescribing in detail exemplary embodiments with reference to theattached drawings in which:

FIG. 1 illustrates a top plane view of a display device according to anexemplary embodiment.

FIG. 2 illustrates a partial enlarged view of an area A of FIG. 1.

FIG. 3 illustrates a cross-sectional view taken along a line I-I′ ofFIG. 2.

FIG. 4 to FIG. 7 illustrate cross-sectional views taken along a lineI-I′ of FIG. 2, as exemplary variations of the exemplary embodiments.

FIG. 8 illustrates a process flowchart of a manufacturing method of adisplay device according to an exemplary embodiment.

DETAILED DESCRIPTION

Example embodiments will now be described more fully hereinafter withreference to the accompanying drawings; however, they may be embodied indifferent forms and should not be construed as limited to theembodiments set forth herein. Rather, these embodiments are provided sothat this disclosure will be thorough and complete, and will fullyconvey exemplary implementations to those skilled in the art.

In the drawing figures, the dimensions of layers and regions may beexaggerated for clarity of illustration. It will also be understood thatwhen a layer or element is referred to as being “on” another layer orsubstrate, it can be directly on the other layer or substrate, orintervening layers may also be present. Further, it will be understoodthat when a layer is referred to as being “under” another layer, it canbe directly under, and one or more intervening layers may also bepresent. In addition, it will also be understood that when a layer isreferred to as being “between” two layers, it can be the only layerbetween the two layers, or one or more intervening layers may also bepresent.

Unless explicitly described to the contrary, the word “comprise” andvariations such as “comprises” or “comprising” will be understood toimply the inclusion of stated elements but not the exclusion of anyother elements. The size and thickness of each configuration shown inthe drawings are arbitrarily shown for better understanding and ease ofdescription, but the exemplary embodiments are not limited thereto. Likereference numerals refer to like elements throughout.

FIG. 1 is a top plane view of a display device according to an exemplaryembodiment, FIG. 2 is a partial enlarged view of an area A of FIG. 1,and FIG. 3 is a cross-sectional view taken along a line I-I′ of FIG. 2.

Referring to FIG. 1 to FIG. 3, a display device 101 according to anexemplary embodiment may include a first substrate 100 and a secondsubstrate 200 assembled with the first substrate 100 and positioned toface the first substrate 100 via a liquid crystal layer.

Here, the display device 101 may include a display area DA displayingthe image and an encapsulation area SA enclosing the display area DA.

The display area DA may include a plurality of signal lines and aplurality of pixels PX connected thereto. The plurality of pixels PX maybe arranged in an approximate matrix shape. Here, the pixel may include,for example, a unit area in which an image corresponding to one imagesignal is displayed, and a transmitting area in which light is actuallytransmitted or emitted and a light blocking area in which the light isblocked. In the light blocking area, an electric device such as a thinfilm transistor for applying a signal to the corresponding pixel PX or ablack matrix, for example, may be positioned.

An outer sealant preventing the liquid crystal layer from being leakedand combining the first substrate 100 and the second substrate 200 maybe formed along the edge of the encapsulation area SA in theencapsulation area SA.

Also, the encapsulation area SA may include a transparent encapsulationarea TSA on one side thereof.

The transparent encapsulation area TSA may include an area in which thecamera is mounted and a camera hole, i.e., opening CH, in which anexternal light is transmitted to flow into the camera lens. Also,several sensors S1 and S2 sensing optical signals other than the imagesignal may be positioned in an area neighboring the opening.

Referring to FIG. 2, the transparent encapsulation area TSA may includean outer sealant 220 sealing between the first substrate 100 and thesecond substrate 200 and formed along a long side of the transparentencapsulation area TSA (e.g., the x-axis direction in FIG. 2). The outersealant 220, as shown in FIG. 2; may be formed in a pair along the longside of the transparent encapsulation area TSA with a predeterminedinterval.

In the exemplary embodiments, for convenience, a first substrate 100 anda second substrate 200 are indicated. The first substrate 100 may be anupper substrate and the second substrate 200 may be a lower substrate,for example, or the first substrate 100 may be the lower substrate andthe second substrate 200 may be the upper substrate, for example.

Referring to FIG. 2, in the plane structure the display device accordingto an exemplary embodiment may include a pattern part 300 neighboringthe outer sealant 220 and extending in a direction to be parallel to theouter sealant 220. In this case, the pattern part may also be formed ina pair with a predetermined interval between the pair of outer sealants220.

Also, in the area neighboring the pattern part 300, a transparentsealant 221 may extend in a direction parallel to the pattern part 300.

In the plane structure, the transparent sealant 221 may cover all of thearea in which the opening CH is formed. The transparent sealant 221 mayhave a wider width than a diameter of the opening CH.

Also, the transparent sealant 221 may be parallel to the outer sealant220, and may be formed along the long side of the transparentencapsulation area TSA, like the outer sealant 220.

In the exemplary embodiments, because the transparent sealant 221 may beparallel to the outer sealant 220 and may extend in a direction at theposition separated from both layers of the outer sealant 220, adherencebetween the first substrate 100 and the second substrate 200 may befurther increased. Further, because the transparent sealant 221 mayfunction to more solidly support the first substrate 100 and the secondsubstrate 200 in the transparent encapsulation area TSA of the displaydevice, warpage of the display panel caused by shrinkage of a film afteradhering a polarization film and/or a protection film to the displaydevice may be effectively suppressed.

Next, referring to FIG. 3, the display device according to an exemplaryembodiment may include a light blocking member 211 positioned on thefirst substrate 100. The light blocking member 211 may be referred to asa black matrix and may function to cover a driver positioned in theencapsulation area SA or control lines connected to the driver such thatthey may not be recognized by the user. Here, the light blocking member211 may include, for example, a pigment for light blocking such ascarbon black, and may include a photosensitive organic material.

The light blocking member 211 may include the opening CH in which theexternal light is transmitted to flow to the camera lens. The opening CHmay correspond to the diameter of the camera adhered to the displaydevice.

In this case, the transparent sealant 221 may include all of the openingCH, for example, may have a width wider than the diameter of the camera.

Next, an overcoat layer 215 for the planarization of the first substrate100 may be formed on the light blocking member 211.

The thickness of the overcoat layer 215 may be substantially equal to orthicker than the thickness of the light blocking member 211 includingthe opening CH. Also, the overcoat layer 215 may include the transparentorganic material, and a viscosity thereof may be appropriatelycontrolled such that the planarization of the first substrate 100 iscontrolled. The overcoat layer 215 may include an organic material of ahigh planarization effect having sufficient viscosity.

Meanwhile, in the display device according to an exemplary embodiment,the pattern part 300 may be on at least one of the light blocking member211 and the overcoat layer 215 on the first substrate 100.

For example, the pattern part 300, as shown in FIG. 3, may be positionedclose to the outer sealant 220 on the overcoat layer 215 with apredetermined interval. However the pattern part 300 may be disposedsuch that it does not overlap the opening CH.

Since the pattern part 300 may be on the overcoat layer 215, thetransparent sealant 221 a is spread to the pattern part 300 and thetransparent sealant 221 may be close thereto, spreading the transparentsealant 221 to the outer sealant 220 and causing an encapsulation defectdue to the reduction of the width or the thickness of the outer sealantmay be prevented. For example, when combining the first substrate 100and the second substrate 200, the transparent sealant 221 may be spreadto the outer sealant 220, and generation of the defect of the liquidcrystal not being completely enclosed and sealed due to the reduction ofthe width of the outer sealant 220 may be almost completely prevented.Also, although the amount of the transparent sealant 221 a is notminutely controlled, since the amount that is capable of beingappropriately spread close to the pattern part 300 is supplied,generation of a bubble within the transparent sealant 221 may beprevented, while all of the opening CH of the light blocking member 211may be covered.

FIG. 4 to FIG. 7 are cross-sectional views taken along a line I-I′ ofFIG. 2, as exemplary variations of the exemplary embodiments.

In an exemplary embodiment, a pattern part 301 formed on the overcoatlayer 215, as shown in FIG. 4, may be the same height as the outersealant 220. As described above, if the pattern part 301 has the sameheight as the outer sealant 220, although the amount of the transparentsealant 221 is not finely controlled, filling of the transparent sealant221 between the first substrate 100 and the second substrate 200 andbetween the pattern parts 301 may be facilitated. Also, while thetransparent sealant 221 may be prevented from being spread to theoutskirts of the transparent encapsulation area TSA, the transparentsealant 221 extending along a direction including the area correspondingto the opening CH in the light blocking member 211 may be intensivelyformed such that a generation ratio of the bubbles may be remarkablyreduced.

Additionally, a pattern part 302, as shown in FIG. 5, may be disposedsuch that it does not overlap the opening CH on the light blockingmember 211 having the opening CH. In this case, as shown in FIG. 5, thepattern parts 302 may be a single layer, while as shown in FIG. 6,pattern parts 303 may be multi-layer.

When the pattern parts 302 and 303 are formed on the light blockingmember 211 and the overcoat layer 215 is coated thereon, the areacorresponding to the opening CH of the overcoat layer 215 may include arecess portion 215 a having a depressed shape to the side of the firstsubstrate 100 due to the step generated by the pattern parts 302 and303.

When forming the transparent sealant 221 within the recess portion 215a, since the transparent sealant 221 is naturally focused on thedepressed area, spreading of the transparent sealant 221 may beprevented such that the thickness of the transparent sealant 221 isdecreased, thereby preventing generation of a bubble in the transparentsealant 221.

In the pattern part 300, the vertical cross-sectional shape of thedirection crossing the long side of the transparent encapsulation areaTSA may be, for example, a trapezoid shape as shown in FIG. 3 and FIG.4, or a rectangle shape as shown in FIG. 5 and FIG. 6, and it may be atleast one of a square, a semicircle, and a semi-ellipse.

A pattern part 304, as shown in FIG. 7, may be simultaneously formed onthe light blocking member 211 and the overcoat layer 215. In this case,the area corresponding to the opening CH of the overcoat layer 215 mayinclude the recess portion 215 a at the side of the first substrate 100due to the step generated by a pattern part 304 b formed on the lightblocking member 211. Also, since a pattern part 304 a may also be formedon the overcoat layer 215, the process forming the transparent sealant221 may be further facilitated. This is because the transparent sealant221 may not spread to the outer area of the transparent encapsulationarea TSA and may be concentrated on the area corresponding to theopening CH within the outer sealant 220.

The pattern part may be formed of a same material as at least one of thematerials of a color filter and a column spacer on the display area DAof the first substrate 100. In detail, when forming the pattern part 300by using the material forming the color filter, the pattern part 300 maybe positioned on the light blocking member 211. When forming the patternpart 300 by using the material forming the column spacer, the patternpart 300 may be positioned on the overcoat layer 215. However, thepattern part 300 is not limited thereto.

In addition, the color filter may include a red color filter, a greencolor filter, and a blue color filter, for example. Here, forconvenience, the red color filter, the green color filter, and the bluecolor filter are described as the only color filters provided, but acolor filter having a different color may be included. In the displaydevice, the color filter formed in the display area DA may be arrangedto correspond to the area of each pixel PX, thereby displaying thecorresponding color.

Also, the interval of the liquid crystal layer between the firstsubstrate 100 and the second substrate 200 is referred to as a cell gap,and the cell gap may affect the overall operation characteristics of thedisplay device, such as response speed, contrast ratio, viewing angle,and luminance uniformity. If the cell gap is not uniform, a uniformimage may not be displayed throughout the screen such that the displayquality deterioration may occur. Accordingly, the column spacer isgenerally formed on one of two substrates to maintain a uniform cell gapthroughout the entire area on the substrate of the display device. Inthe exemplary embodiments, the column spacer, as described above, meansthe spacer formed on the display area DA to maintain the uniform cellgap.

As described above, the display device according to the exemplaryembodiments may include the pattern part 300 extending in a directionparallel to the outer sealant 220 on the transparent encapsulation areaTSA of the first substrate 100 and the transparent sealant 221 extendingin a direction parallel to the pattern part 300 and close to the patternpart 300. Thus, an empty space of a vacuum state may be prevented fromforming between the first substrate 100 and the second substrate 200.

Accordingly, the diffraction pattern of concentric circles may beprevented on the image photographed by using the camera mounted on thedisplay device. Also, since the transparent sealant 221 is concentratedhaving a width that may be larger than a width of the area correspondingto the opening CH to allow the external light to flow into the cameralens, a bubble in the transparent sealant 221 may be prevented such thatthe image quality of the camera mounted on the display device may beremarkably improved.

FIG. 8 is a process flowchart showing a manufacturing method of adisplay device according to an exemplary embodiment.

Referring to FIG. 8, the manufacturing method of the display device mayinclude a step of forming a pattern part 300 (S10), a step of forming anouter sealant 220 (S20), a step of forming the transparent sealant 221(S30), and a sealing step (S40). In the manufacturing method of thedisplay device according to the exemplary embodiments, the order of thesteps is not limited and may be changed.

First, the step (S10) of forming the pattern part 300, in the planestructure as shown in FIG. 2, is performed to extend the pattern part300 in a direction along the long side of the transparent encapsulationarea TSA on the prepared first substrate 100 or second substrate 200.

In this case, the first substrate 100 or the second substrate 200 mayinclude the insulating material such as glass or plastic, for example.

In the manufacturing method of the display device according to anexemplary embodiment, the step (S10) of forming the pattern part 300 maybe simultaneously performed with a step of forming a color filter on thedisplay area DA of the first substrate 100.

The step of forming the color filter may be performed by using aphotolithography process, or an inkjet method, for example. Accordingly,in the process of forming the color filter in the display area DA, afterpatterning the pattern part 300 on the transparent encapsulation areaTSA, the color filter may be formed on the transparent encapsulationarea TSA by using the photolithography process or the inkjet printingprocess.

As described above, the pattern part 300 on the transparentencapsulation area TSA may be simultaneously formed with the step offorming the color filter on the light blocking member 211, and they maybe formed of a single layer and/or a multi-layer.

In this case, since a step is generated on the overcoat layer 215 due tothe pattern part 300 being formed on the light blocking member 211, therecess portion 215 a of the first substrate 100 may be formed on thearea corresponding to the opening CH in the light blocking member 211.

On the other hand, in the manufacturing method of the display deviceaccording to another exemplary embodiment, the step S10 of forming thepattern part 300 may be simultaneously performed with a step of forminga column spacer on the display area DA of the first substrate 100.

The step of forming the column spacer may be performed by using thephotolithography process, for example. Accordingly, after coating thematerial for forming the column spacer on the display area DA and thetransparent encapsulation area TSA, the pattern part 300 may be formedon the transparent encapsulation area TSA by a method of lightirradiation and etching, for example, by using a mask patterned with thepattern part 300 be formed on the area corresponding to the transparentencapsulation area TSA.

Here, the material for forming the column spacer may be, for example, ablack-based material, and the black-based material may be a materialincluding at least one of carbon black, an organic pigment, an inorganicpigment, and an RGB mixture pigment.

As described above, the pattern part 300 of the transparentencapsulation area TSA that is simultaneously formed with the step offorming the column spacer may be formed on the overcoat layer 215. Inthis case, the pattern part 300 may be formed, as described above, witha same height as the outer sealant 220 and may be lower than the outersealant 220, but it is not specifically limited thereto.

As described above, in the manufacturing method of the display deviceaccording to the exemplary embodiments, a separate process to form thepattern part 300 on the transparent encapsulation area TSA is notrequired. Further, the process of forming the color filter and thecolumn spacer on the display area DA and a method of adding the desiredpattern may be performed on the transparent encapsulation area TSA,thereby simplifying the manufacturing process.

Next, the step (S20) of forming the outer sealant 220 may be performedby coating the material for forming the outer sealant 220. The outersealant 220 may extend in a direction to be parallel to the pattern part300 and be separated with a predetermined interval.

In this case, the outer sealant 220 may be formed, for example, of apolymer mixture mixed with an epoxy resin and a curing accelerator, andmay be transparent. Also, the outer sealant 220 may be hardened byheating and/or UV irradiation, for example, and, thereby, serve as anadhesive maintaining the combination state of the first substrate 100and the second substrate 200.

Next, the step (S30) of forming the transparent sealant 221 may beperformed such that the transparent sealant 221 may be close to thepattern part 300 and may extend in a direction to be parallel to thepattern part 300.

The step of forming the transparent sealant 221 may be formed by aone-time process, for example, a drawing process.

In this case, the transparent sealant 221 may be formed of the polymermixture mixed with the epoxy resin and the curing accelerator, and maybe hardened by the heating and/or the UV irradiation. Additives of thetransparent sealant 221 may be added to appropriately control theviscosity.

Accordingly, the formed sealant 221 may be naturally spread to the sideof the pattern part 300 and formed to meet the first substrate 100 andthe second substrate 200 while meeting the pattern part 300 and fullyfilling the recess portion 215 a formed in the overcoat layer 215.

In detail, the transparent sealant 221 may be formed on the pattern part300 formed on the overcoat layer 215 and in the recess portion 215 a onthe overcoat layer 215 formed by the pattern part 300 formed on thelight blocking member 211, while the transparent sealant 221 isappropriately spread.

Accordingly, since the insertion amount of the transparent sealant 221is not minutely controlled and the appropriate amount thereof issupplied, the process characteristic may become excellent. Also, sincethe area corresponding to the opening CH may be completely covered byonly a one-time process by supplying the appropriate amount, as in theconventional art, for example, the drawing process covering all of theopening does not need to be repeatedly performed. Resultantly, sinceformation of a bubble in the transparent sealant 221 may be almostcompletely prevented, the generation ratio of the bubbles may beremarkably reduced. Also, a defect rate caused by the transparentsealant 221 that is spread to the side of the outer sealant 220 may beremarkably reduced.

Next, the sealing step (S40) is performed. The first substrate 100 andthe second substrate 200 may be disposed to face each other. The outersealant 220 and the transparent sealant may be hardened through theheating and/or the UV light irradiation, for example, thereby sealingthe first substrate 100 and the second substrate 200 and manufacturingthe display device.

According to the manufacturing method of the display device according tothe exemplary embodiments, the pattern part 300 may be easily formed inthe transparent encapsulation area TSA without a separate process.Further, the transparent sealant 221 may be easily and accurately formedto be close to the pattern part 300 and to extend in a directionparallel to the pattern part 300 by only a one-time process. Since thetransparent sealant 221 without a bubble may be formed at the positioncorresponding to the opening CH, the display device having the excellentcamera image quality may be manufactured.

By way of summation and review, exemplary embodiments provide a displaydevice that may have improved camera image quality.

In general, an extra space is required in a display panel to build acamera into the display device. This arrangement does not serve tominimize a bezel area on the periphery of the display panel. To overcomethis problem, a black matrix having an opening may be formed on one ofan upper substrate or a lower substrate of the display panel, and thecamera may be mounted on the other of the upper substrate or the lowersubstrate corresponding to the opening.

However, in this case, an empty space of a vacuum state is formedbetween the black matrix near the opening and the facing substrate. Ingeneral, by diffraction of light passing through the substrate made ofglass and the camera lens, a diffraction pattern of concentric circlesis generated on the image photographed with the camera.

In order to improve this, filling the empty spaces with a transparentsealant has been attempted, but in the process of filling thetransparent sealant, a minute bubble is formed in the transparentsealant such that the image quality of the camera is deteriorated.

To overcome this problem, by extending a pattern part in a direction tobe parallel to an outer sealant sealing the upper and lower substrateson a transparent encapsulation area of the substrate in which a camerahole is positioned, and by extending a transparent sealant in adirection to be parallel to the pattern part on the area correspondingto the camera hole, the above-described problem may be overcome and thecamera image quality of the display device may be improved.

The display device according to exemplary embodiments may prevent abubble from being generated in the transparent sealant formed on thetransparent encapsulation area such that the diffraction pattern may beprevented in the image photographed by the built-in camera of thedisplay device, thereby remarkably improving the camera image quality ofthe display device.

Example embodiments have been disclosed herein, and although specificterms are employed, they are used and are to be interpreted in a genericand descriptive sense only and not for purpose of limitation. In someinstances, as would be apparent to one of ordinary skill in the art asof the filing of the present application, features, characteristics,and/or elements described in connection with a particular embodiment maybe used singly or in combination with features, characteristics, and/orelements described in connection with other embodiments unless otherwisespecifically indicated. Accordingly, it will be understood by those ofskill in the art that various changes in form and details may be madewithout departing from the spirit and scope of the present invention asset forth in the following claims.

What is claimed is:
 1. A method for manufacturing a display device, themethod comprising: forming a pattern part outside a display area of thedisplay device, the pattern part extending in a direction along a sideof a transparent encapsulation area of a first substrate or a secondsubstrate; forming an outer sealant parallel to the pattern part afterforming the pattern part, the outer sealant being on a first side of thepattern part; forming a transparent sealant adjacent to the pattern partafter forming the pattern part, the transparent sealant being on asecond side of the pattern part opposite the first side and extending ina direction parallel to the pattern part such that the transparentsealant has a predetermined interval with the outer sealant and fillsbetween the first substrate and the second substrate; and sealing thefirst substrate and the second substrate.
 2. The method as claimed inclaim 1, wherein forming the transparent sealant is performed by aone-time process.
 3. The method as claimed in claim 1, wherein formingthe pattern part is simultaneously performed with a step of forming acolor filter in a display area of the first substrate that displays animage.
 4. The method as claimed in claim 1, wherein forming the patternpart is simultaneously performed with a step of forming a column spacerin a display area of the first substrate that displays an image.
 5. Themethod as claimed in claim 1, wherein sealing the first substrate andthe second substrate includes: disposing the first substrate and thesecond substrate so as to face each other; and hardening the outersealant and the transparent sealant through at least one of heating andultraviolet (UV) light irradiation.
 6. The method as claimed in claim 1,wherein the first substrate further includes a light blocking memberincluding an opening, and the transparent sealant includes an areaoverlapping the opening.
 7. The method as claimed in claim 6, whereinthe transparent sealant includes an area completely overlapping theopening.
 8. The method as claimed in claim 6, wherein a width of thetransparent sealant is larger than a diameter of the opening.
 9. Themethod as claimed in claim 1, wherein: the pattern part includes firstand second pattern parts, the transparent sealant extending between thefirst and second pattern parts, the outer sealant includes first andsecond outer sealants, the first pattern part is between the transparentsealant and the first outer sealant, and the second pattern part isbetween the transparent sealant and the second outer sealant.
 10. Themethod as claimed in claim 9, wherein the transparent sealant is indirect contact with each of the first and second pattern parts.
 11. Amethod for manufacturing a display device, the method comprising:forming a pattern part extending in a direction along a side of atransparent encapsulation area of a first substrate or a secondsubstrate, the first substrate including a light blocking memberincluding an opening; forming an outer sealant parallel to the patternpart; forming a transparent sealant adjacent to the pattern part andextending in a direction parallel to the pattern part such that thetransparent sealant has a predetermined interval with the outer sealantand fills between the first substrate and the second substrate; andsealing the first substrate and the second substrate, wherein thepattern part separates the transparent sealant from the outer sealant.12. The method as claimed in claim 11, wherein sealing the firstsubstrate and the second substrate includes: disposing the firstsubstrate and the second substrate so as to face each other; andhardening the outer sealant and the transparent sealant through at leastone of heating and ultraviolet (UV) light irradiation.
 13. The method asclaimed in claim 11, wherein the transparent sealant has a predeterminedinterval with respect to the outer sealant.
 14. The method as claimed inclaim 11, further comprising forming an overcoat layer on the lightblocking member such that the overcoat layer is between the lightblocking layer and the transparent sealant.